Характеристики:

Version 3 of Mugen provides higher compatility with a new more compactly designed fin and a thoroughly thought out backplate. The total cooling performance has been increased by refining the M.A.P.S. (Multiple Airflow Pass-through Structure). Mugen 3 comes with the "Slip Stream" PWM Silent fan for minimizing the noise level at low load as well as maximizing the cooling performance at heavy load.

Specifications

Model Name:
Mugen 3 CPU Cooler

Model Number.:
SCMG-3000

Manufacturer:
Scythe Co., Ltd. Japan

Compatibility:
Intel®:
Socket LGA1155
Socket LGA1156
Socket T / LGA775
Socket LGA1366

AMD®:
Socket AM2
Socket AM2+
Socket AM3

Combined Dimensions:
130 x 100 x 158 mm / 5.12 x 3.94 x 6.22 in

Fan Dimensions:
120 x 120 x 25 mm / 4.72 x 4.72 x 25 in

Noise Level:
9.60 - 32.15 dBA

Air Flow:
14.7 - 88.11 CFM = 16,31 - 149,67 m³/h

Fan Speed:
300(±180 rpm) - 1,600 rpm(±10%)

Weight:
825 g / 29.10 oz

Material of Base Plate:
Nickel-plated copper (more information)

Features

F.M.S.B.4 (Flip Mount Super Back-Plate 4)
Introducing F.M.B.S.4 (Flip Mount Super Back-Plate 4) for higher compatibility with new generation Motherboards! This universally compatible Back-Plate is capable of mounting large coolers very rigidly on to your Motherboard.

Slip Stream PWM + Wide Range Cooling Purposes
The fan motor applied is a Slipstream PWM 120 x  120 x 25mm small axis large fan blade model, which minimizes the noise at low load, as sell as maximizing the performance of Mugen 3 at heavy load. The fan runs at the speed of 300 rpm (± 180rpm) ~ 1600 rpm (± 10%), generating an air flow of 14.7 CFM ~ 88.11 CFM =  24.98 ~ 149,7 m³/h at a noise level of 9.6 ~ 32.15 dBA. The overall cooling has been carefully designed to meet our Wide Range Cooling Purposes philosophy, providing high level performance for both silent cooling or over-clocking.

M.A.P.S. (Multiple Airflow Pass-Through Structure)
By introducing the newly refined M.A.P.S. (Multiple Airflow Pass-through Structure) the total cooling performance has been upgraded by optimizing the pass-through function of the airflow and enhancement of the sturdiness of the heatsink.

Awards